MediaTek Nukes Snapdragon? Dimensity 9400’s 3nm Chip & 70 TOPS AI Exposed
MediaTek is firing shots straight at Qualcomm with its upcoming Dimensity 9400 chipset, and if early leaks are accurate, it could be the most powerful and efficient mobile SoC ever built. According to reports from Digitimes and tipsters on Weibo, the Dimensity 9400 will not only outperform Snapdragon Gen 3 but introduce jaw-dropping AI and gaming capabilities.
🚀 Spec Bomb: Dimensity 9400 Highlights
🔧 Built on TSMC’s 3nm N3E Process
The Dimensity 9400 is reportedly being fabbed on TSMC’s advanced N3E 3nm node, delivering up to 30% power efficiency gains over last-gen chips. This makes it not only powerful but also cooler and more battery-friendly—ideal for flagship devices that demand sustained performance.
🤖 70 TOPS NPU – On-Device Llama 3 (13B)
AI is where Dimensity 9400 makes its boldest statement. The chipset features a Neural Processing Unit capable of 70 TOPS (Tera Operations Per Second)—enough to run Meta’s 13B parameter Llama 3 model directly on the device, without relying on the cloud. This opens up the door for truly offline AI assistants, real-time translation, code completion, and next-gen camera intelligence.
🎮 Hardware-Accelerated Ray Tracing (Exclusive to vivo X200 Pro)
MediaTek is also turning heads in the gaming arena, integrating hardware-level ray tracing, confirmed to be available on the vivo X200 Pro. Expect hyper-realistic lighting, shadows, and reflections in supported titles—something previously limited to PC and console gaming.
📱 Target Devices: Coming October 2025
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vivo X200 Pro – Flagship AI + Gaming Beast
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Redmi K80 Pro – Premium Performance at Budget Price
Both phones are tipped to debut with the Dimensity 9400 in October 2025, putting Qualcomm’s next-gen Snapdragon under serious pressure.
💥 Why This Leak Matters
With the 9400, MediaTek is no longer playing catch-up—it’s taking the lead. Between the 3nm efficiency, on-device LLM performance, and console-class gaming features, this chip is designed to set a new bar for mobile processors.
Snapdragon Gen 4 has been warned.
📸 Suggested Thumbnail / Banner Image
Visual concept:
A blazing microchip with “Dimensity 9400” label glowing, AI code and Llama 3 model icons in the background, with a side-by-side silhouette of vivo X200 Pro and Redmi K80 Pro.
Text overlay:
"3nm Power. 70 TOPS AI. Ray Tracing."
🔗 Social Sharing Teaser (Twitter / Facebook / Threads)
⚠️ MediaTek nukes Snapdragon?!
Dimensity 9400 leaks show 3nm power, 70 TOPS AI, Llama 3 model running on-device, and ray tracing! Launching Oct with vivo X200 Pro.
👉 Full Specs & Details: [your-article-link]
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Dimensity 9400 Leak: 3nm, 70 TOPS AI, Llama 3 & Ray Tracing Confirmed -
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MediaTek Dimensity 9400 chipset leak reveals 3nm TSMC N3E process, 70 TOPS AI NPU capable of running Llama 3, and hardware ray tracing for vivo X200 Pro. Launches Oct 2025.